Numéro
Rev. Phys. Appl. (Paris)
Volume 23, Numéro 4, avril 1988
Page(s) 677 - 677
DOI https://doi.org/10.1051/rphysap:01988002304067700
Rev. Phys. Appl. (Paris) 23, 677-677 (1988)
DOI: 10.1051/rphysap:01988002304067700

A study of cross slip activation parameters in copper

J. Bonneville

EPF Lausanne, Institut Génie Atomique 1015 - Lausanne (Suisse)

Without abstract


PACS
6170J - Etch pits, decoration, transmission electron microscopy and other direct observations of dislocations.
6170L - Slip, creep, internal friction and other indirect evidence of dislocations.
6220F - Deformation and plasticity.

Key words
copper -- plastic deformation -- screw dislocations -- slip -- transmission electron microscope examination of materials -- cross slip activation parameters -- yield stress -- Escaig's model -- TEM -- dislocations -- deformation -- 250 to 400 K -- Cu

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